New circuit design functions at temperatures greater than 650 F The silicon-carbide wafer contains more 1,000 individual circuits Engineering researchers at the University of Arkansas have designed integrated circuits that can survive at temperatures greater than 350 C—or roughly 660 F. Their work, funded by the National Science Foundation, will improve the functioning of processors, drivers, controllers and other analog and digital circuits used in power electronics, automobiles and aerospace equipment—all of which must perform at high and often extreme temperatures. “This ruggedness allows these circuits to be placed in locations where standard silicon-based parts can’t survive,” said Alan Mantooth, Distinguished Professor. “The circuit blocks we designed contributed to superior performance of signal processing, controllers and driver circuitry. We are extremely excited ab...
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